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Defect content | Cause | Measures |
---|---|---|
Short shot | *Insufficient capacity of molding machine | Increase working temperature and increase screw speed and back pressure. |
*Insufficient capacity of molding machine | Increase working temperature and increase screw speed and back pressure. | |
*Insufficient capacity of molding machine | Increase working temperature and increase screw speed and back pressure. | |
Sink Mark | *Insufficient pressure within the mold | Increase the sprue, runner, and gate dimensions. |
Increase the packing pressure and packing time, and adjust the packing pressure switching point (position). | ||
*Cooling unevenness | Product design changes | |
Warpage | *Uneven or insufficient cooling | Increase cooling time. Lower mold temperature. |
Correct the coolant position to ensure uniform cooling. | ||
*In case of direction of contraction | Consider the variation in shrinkage rate when manufacturing molds. | |
Lower mold temperature | ||
Gate location and number adjustment | ||
Install ribs considering bending direction | ||
Silver streak | *Moisture and volatile matter | Dry thoroughly. |
*Decomposition of resin | Adjust the injection time by lowering the cylinder temperature and shortening the residence time. | |
*Air intake within the screw | Reduce the temperature at the rear of the cylinder and increase the back pressure. | |
*When the injection speed is fast | Reduce the injection speed to allow volatile gases to escape. | |
*When volatile matter settles on the mold surface | Clean the mold surface. | |
Silver streak | Raise the resin temperature and injection speed. | |
*In case of residual stress during molding | Increase the thickness of the product. | |
Prevents cavity overfilling | ||
Flow Mark | *When resin flowability is low | Increase cylinder and mold temperature. |
*In case of mixing of other resins in the resin | Change resin | |
*When the mold temperature is low | Raise the mold temperature. | |
Jetting | *When the flowability of resin is poor | Raise the cylinder temperature and lower the injection speed. |
*In case of bad mold design | Increase gate size | |
*Mold temperature is low | Raise the mold temperature. |